Replace on Course of Know-how and Roadmaps

Update on Process Technology and Roadmaps

Earlier this yr, new Intel CEO Pat Gelsinger outlined his new ‘IDM 2.0’ imaginative and prescient for Intel. This imaginative and prescient was a 3 pronged technique primarily based on bettering its personal course of node know-how, mixing in different foundry know-how the place wanted, and in addition realigning its manufacturing for a brand new foundry service providing permitting different semiconductor corporations to make use of Intel’s manufacturing experience. As a part of the journey in the direction of Gelsinger’s IDM 2.0 imaginative and prescient, we had been informed to anticipate updates at a extra common cadence, and the announcement of ‘Intel Accelerated’ in a few weeks is the subsequent occasion on the calendar.

Intel IDM 2.0

As AnandTech reported again in March, Intel’s IDM 2.0 technique options the next:

  • Construct (on Intel 7nm)
  • Develop (use TSMC and others)
  • Productize (Intel Foundry Providers)

Beforehand Intel was virtually utterly insular, preferring to make use of its personal applied sciences virtually solely, and it saved them to itself. By means of IDM 2.0, CEO Pat Gelsinger is hoping to drive Intel’s subsequent wave of merchandise through the use of the perfect the market has to supply, but additionally broaden Intel’s personal manufacturing to new clients as a possible income stream. The guise of this improvement can be within the sense of aligning semiconductor manufacturing exterior of Asia, to make different areas of the world much less reliant on a single useful resource.

A part of this technique requires Intel to execute on its analysis roadmaps. Intel’s struggles to allow 10nm in suitably excessive volumes have been the main target of loads of column inches, and whereas Intel is now delivery 10nm Tiger Lake-H within the tens of millions* and 10nm Ice Lake Xeons within the tons of of hundreds*, there’s a want to handle the way forward for Intel’s manufacturing. This implies ensuring it aligns with industrial pursuits and permits a aggressive providing towards the competitors. This covers not solely manufacturing, to which Intel introduced a $20b funding in its Arizona manufacturing earlier this yr, but additionally superior packaging applied sciences, the place Intel introduced a $3.5b funding in its New Mexico services in Could.

Intel’s Ocotillo Campus, Arizona

A part of creating its Intel Foundry Providers providing for exterior events to make use of Intel manufacturing depends on Intel being extra open about its know-how and showcasing progress in its analysis and improvement, maybe to a level greater than it has finished up to now. Any future clients of Intel’s IP portfolio will need to know what’s coming down the pipe, particularly when silicon improvement takes years and getting the fitting timing in alignment of applied sciences turns into crucial in these aggressive markets. Having a platform to showcase Intel’s roadmaps is what this upcoming Intel Accelerated Webcast appears to be about.

Intel Accelerated

On Monday July 26th, 2pm Pacific, Intel will livestream its Intel Accelerated webcast. The subjects of the day are shows from CEO Pat Gelsinger and Dr. Ann Kelleher* on Intel’s course of node know-how improvement and roadmaps into Intel’s packaging portfolio. Dr. Ann Kelleher is Intel’s SVP and GM of Know-how Growth, and the particular person in command of all of this.

We hope that this webcast will go into element as to the place Intel expects its 10nm improvement to go on SuperFin/Enhanced SuperFin, main into discussions about 7nm. Whereas Intel received’t be discussing issues like buried energy rails or new manufacturing strategies, we’ll hopefully see a disclosure extra akin to TSMC and Samsung’s Foundry occasions that occur yearly concerning what variations of course of node improvement are being focused.

On the packaging entrance, we all know that Intel has EMIB, Foveros, and ODI beneath analysis up towards TSMC’s 3DFabric, so insights into how Intel is growing its know-how will probably be welcome by each the semiconductor trade but additionally the monetary markets. Curiously sufficient, whereas this occasion is on the 26th, Intel’s quarterly monetary disclosures are on the 22nd, a couple of days prior. On Intel’s packaging, as the corporate strikes into its Shopper 2.0 technique of drilling all the pieces down into silicon IP blocks, understanding precisely how these will all be related turns into a significant ingredient to the way forward for Intel.

The occasion will probably be open to all on Intel’s Newsroom.

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